IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.Membership in IEEE's technical societies provides access to top quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.

IEEE關于組件、封裝和制造的交易涵蓋了以下內容領域：建模、設計、構建模塊、技術基礎設施和支持電子、光子和MEMS封裝的分析，以及無源組件、電氣觸點和連接器、熱管理和設備可靠性方面的新發展；以及電子零件和總成的制造，具有廣泛的設計、工廠建模、裝配方法、質量、產品魯棒性和環境設計。IEEE技術協會的會員資格提供了訪問頂級出版物的機會，如作為會員利益或通過折扣訂閱。該雜志的電子版是CPMT協會會員的一部分，但也提供所有媒體類型的購買。