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IEEE Transactions on Components Packaging and Manufacturing Technology

SCI/SCIE
IEEE Transactions on Components Packaging and Manufacturing Technology
雜志名稱:IEEE元件封裝和制造技術匯刊
簡稱:IEEE T COMP PACK MAN
期刊ISSN:2156-3950
大類研究方向:工程技術
影響因子:1.86
數據庫類型:SCI/SCIE
是否OA:No
出版地:UNITED STATES
年文章數:224
小類研究方向:工程技術-工程:電子與電氣
審稿速度:一般,3-6周
平均錄用比例:容易
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IEEE Transactions on Components Packaging and Manufacturing Technology

英文簡介

IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.Membership in IEEE's technical societies provides access to top quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.

IEEE Transactions on Components Packaging and Manufacturing Technology

中文簡介

IEEE關于組件、封裝和制造的交易涵蓋了以下內容領域:建模、設計、構建模塊、技術基礎設施和支持電子、光子和MEMS封裝的分析,以及無源組件、電氣觸點和連接器、熱管理和設備可靠性方面的新發展;以及電子零件和總成的制造,具有廣泛的設計、工廠建模、裝配方法、質量、產品魯棒性和環境設計。IEEE技術協會的會員資格提供了訪問頂級出版物的機會,如作為會員利益或通過折扣訂閱。該雜志的電子版是CPMT協會會員的一部分,但也提供所有媒體類型的購買。

IEEE Transactions on Components Packaging and Manufacturing Technology

中科院分區
大類學科 分區 小類學科 分區 Top期刊 綜述期刊
工程技術 3區 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學:綜合 ENGINEERING, MANUFACTURING 工程:制造 3區 3區 4區

IEEE Transactions on Components Packaging and Manufacturing Technology

JCR分區
JCR分區等級 JCR所屬學科 分區 影響因子
Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Q3 1.922
ENGINEERING, MANUFACTURING Q4
MATERIALS SCIENCE, MULTIDISCIPLINARY Q4

IEEE Transactions on Components Packaging and Manufacturing Technology

中科院JCR分區歷年趨勢圖

IEEE Transactions on Components Packaging and Manufacturing Technology

影響因子
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